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Signal Integrity

Tools

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si-expertise

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1) Stackup Design
  • Providing suggestions to achieve better layer structure by ensuring proper reference thereby minimizing Crosstalk and EMI related issue.
  • Dielectric Material suggestion for High speed designs to minimize Channel Loss.
2) Pre Layout Signal Integrity Analysis
  • Topology Creation
  • Determination of termination schemes, placement optimization & Trace length optimization.
  • Via designing for High speed serial links.
  • Providing Layout guidelines to Layout engineer.
  • Time Domain Analysis.
  • Transient Analysis - Validating the logic level, Drive strengths, Thresholds, Over/Under shoot, Propagation Delay, Noise margin, Slew Rate, Timing Budget (setup/Hold time).
  • Eye Diagram Analysis - Eye Opening and Jitter Validation.
  • Frequency Domain Analysis - Channel loss (IL & RL) characteristics for SERDES links.
  • NEXT & FEXT validation for SERDES signals.
3) Post Layout Signal Integrity Analysis
  • Layout Review to ensure Best layout practice.
  • Topology extraction with Actual PCB Parasitics.
  • Time Domain Analysis.
  • Transient Analysis - Validating the logic level, Drive strengths, Thresholds, Over/Under shoot, Propagation Delay, Noise margin, Slew Rate, Timing Budget (setup/Hold time).
  • Eye Diagram Analysis - Eye Opening and Jitter Validation.
  • Crosstalk level estimation for Parallel bus interface signals.
  • Frequency Domain Analysis - Channel loss (IL & RL) characteristics for SERDES links.
  • NEXT & FEXT validation for SERDES signals.

Power integrity Analysis

1) DC Drop Analysis
  • Analyzing power distribution networks to validate IR Drop caused due to losses present in conduction materials and layout constraints.
  • Results indicating current density and voltage values at each power pins of circuit devices.
  • 3D plot generation representing voltage and current distribution through the power planes.
2) Decoupling Analysis
  • Analyzing impedance response of power distribution network at multiple board locations across a broad range of frequencies.
  • Optimizing the usage of capacitors based on performance and placement on the board.
  • Stackup suggestions for proper board decoupling.
3) Plane Noise Analysis
  • Analyzing Simultaneous Switching Noise created in power distribution networks due to high switching frequencies.
  • Ensuring optimum decoupling to reduce noise (power bounce and ground bounce) coupling effects.

EMI-Analysis

  • Far field net level radiated emissions spectrum generated considering a single signal at a time helps in identification of the emission level from the trace geometries at required distance from the source and provides provision to compare with emission standards.

Thermal analysis

1) Board level Thermal Analysis
  • Embedding thermal parameters along with surrounding environment and boundary conditions.
  • Simulation performed for all ambient temperature conditions.
  • Results include Component temperature profile, Board temperature profile and Board gradient results to understand the overall thermal behaviour of the board.
  • Modelling heat sinks and thermal plates to ensure proper heat dissipation.
2) System Level Thermal Analysis
  • Environmental Conditions.
  • Pre-Simulation Analysis and the benefits of the first law of thermodynamics.
  • Modes of Heat transfer and the effect on System Level.

RELIABILITY ANALYSIS

PTC Windchill quality solutions

1) MTBF Reliability Analysis
  • Embedding component parameters like temperature and current rating.
  • Simulation performed for all environment conditions.
  • Mean Time Between Failure (MTBF) study.
  • Simulation is performed to calculate the Failure rate of the system .
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