Eye Diagram Analysis - Eye Opening and Jitter Validation.
Crosstalk level estimation for Parallel bus interface signals.
Frequency Domain Analysis - Channel loss (IL & RL) characteristics for SERDES links.
NEXT & FEXT validation for SERDES signals.
Pre Layout Signal Integrity Analysis
Power integrity Analysis
1) DC Drop Analysis
Analyzing power distribution networks to validate IR Drop caused due to losses present in conduction materials and layout constraints.
Results indicating current density and voltage values at each power pins of circuit devices.
3D plot generation representing voltage and current distribution through the power planes.
Dc Drop analysis
2) Decoupling Analysis
Analyzing impedance response of power distribution network at multiple board locations across a broad range of frequencies.
Optimizing the usage of capacitors based on performance and placement on the board.
Stackup suggestions for proper board decoupling.
3) Plane Noise Analysis
Plane Noise Analysis
Analyzing Simultaneous Switching Noise created in power distribution networks due to high switching frequencies.
Ensuring optimum decoupling to reduce noise (power bounce and ground bounce) coupling effects.
Far field net level radiated emissions spectrum generated considering a single signal at a time helps in identification of the emission level from the trace geometries at required distance from the source and provides provision to compare with emission standards.
1) Board level Thermal Analysis
Board level Thermal Analysis
Embedding thermal parameters along with surrounding environment and boundary conditions.
Simulation performed for all ambient temperature conditions.
Results include Component temperature profile, Board temperature profile and Board gradient results to understand the overall thermal behaviour of the board.
Modelling heat sinks and thermal plates to ensure proper heat dissipation.
2) System Level Thermal Analysis
System Level Thermal Analysis
Pre-Simulation Analysis and the benefits of the first law of thermodynamics.
Modes of Heat transfer and the effect on System Level.
PTC Windchill quality solutions
1) MTBF Reliability Analysis
Embedding component parameters like temperature and current rating.
Simulation performed for all environment conditions.
Mean Time Between Failure (MTBF) study.
Simulation is performed to calculate the Failure rate of the system .