Markets

  • encryption/computing
  • network servers and storage
  • semiconductor eval boards
  • communication – 5G, IOT
  • defence
  • power
  • medical
  • automotive

Chipset Implementation

  • Intel Xeon D Series
  • Intel Denverton
  • Intel Skylake & Kabylake
  • Qualcomm Snapdragon 625
  • Xilinx UltraScale and UltraScale+ FPGAs
  • Xilinx 5, 6 and 7 Series (Kintex, Virtex, Artix)
  • Xilinx Zynq UltraScale+ MPSoC
  • eXilinx Zynq-7000 SoC
  • Intel Arria X
  • NXP i.Mx series
  • TI TMS320 series DSPs

Technology

  • Flexi rigid designs
  • Embedded passives
  • Components more than 10000/BOARD, Connections more than 97000/BOARD
  • Stringent Thermal, Mechanical and Electrical requirements
  • Layers up to 72
  • Composite stackups - ( ITEQ, ISOLA, PANASONIC, MEGATRON, NELCO,
    ROGERS etc...)
  • Fine pitch BGA upto 0.37mm, 2mil/2mil technology

High Speed Digital, RF, Power, Mixed Signal Designs

  • Flexi rigid designs
  • Embedded passives
  • Components more than 10000/BOARD, Connections more than 97000/BOARD
  • Stringent Thermal, Mechanical and Electrical requirements
  • Layers up to 72
  • Composite stackups - ( ITEQ, ISOLA, PANASONIC, MEGATRON, NELCO,
    ROGERS etc...)
  • Fine pitch BGA upto 0.37mm, 2mil/2mil technology

Chipset Implementation

  • Design for optimum volume production yields for fine pitch BGA’s.
  • Small form factor designs.

Database Conversion

SCHEMATICS & LAYOUT LICENCES

SCHEMATICS & LAYOUT LICENCES

pcb-design process

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