Allegro, Altium, Cadstar, Expedition, PADS

Markets

  • encryption/computing
  • network servers and storage
  • semiconductor eval boards
  • communication – 5G, IOT
  • defence
  • power
  • medical
  • automotive

Chipset Implementation

  • Intel Xeon D Series
  • Intel Denverton
  • Intel Skylake & Kabylake
  • Qualcomm Snapdragon 625
  • Xilinx UltraScale and UltraScale+ FPGAs
  • Xilinx 5, 6 and 7 Series (Kintex, Virtex, Artix)
  • Xilinx Zynq UltraScale+
    MPSoC
  • eXilinx Zynq-7000 SoC
  • Intel Arria X
  • NXP i.Mx series
  • TI TMS320 series DSPs

Technology

  • Flexi rigid designs
  • Embedded passives
  • Components more than 10000/BOARD, Connections more than 97000/BOARD
  • Stringent Thermal, Mechanical and Electrical requirementss
  • Layers up to 72
  • Composite stackups - ( ITEQ, ISOLA, PANASONIC, MEGATRON, NELCO,
    ROGERS etc...)
  • Fine pitch BGA upto 0.37mm, 2mil/2mil technology

High Speed Digital, RF, Power, Mixed Signal Designs

  • Very tight timing and skew requirements
  • Interfaces – DDR4, SFP, Ethernet, HDMI, USB
  • Onboard printed Antennas for GSM, GPS & GPRS band

HDI DESIGN CAPABILITY

  • Design for optimum volume production yields for fine pitch BGA’s.
  • Small form factor designs.

Database Conversion

SCHEMATICS & LAYOUT LICENCES

LAYERS VS JOB(%)

pcb-design process

COMPLEX PCB-DESIGNS

Image

No of layers : 16 layers
Total no of components- 3905
Board size : 180.60 mm x 148.50 mm

Image

No of layers : 22 layers
Total no of components- -6739
Board size : 350.00 mm x 467.00 mm

Image

No of layers : 20 layers
Total no of components- 7855
Board size : 320.00 mm x 335.00 mm

Image

No of layers : 28 layers
Total no of components -14051
Board size : 471.80 mm x 355.60 mm

Quick Links

Contact us

 

Copyright © 2019 SIENNA ECAD Technologies. All Rights Reserved | Disclaimer Policy | Designed & Developed by Webbazaar